Method of connecting lead wires and terminals



Nov. 18, 1941. E. R. MURPHY 2,262,901

METHOD OF CONNECTING LEAD WIRES AND TERMINALS Filed June 10., 1941 2 Sheets-Sheet l Edward. E .Murphy,

\ arbor/Man Nov. 18, 1941. E. R. MURPHY 2,262,901

METHOD OF CONNECTING LEAD WIRES AND TERMINALS Filed June 10, 1941 I Sheets-Sheet 2 Patented Nov. 18, 1941 METHOD OF CONNECTING LEAD WIRES AND TERMINALS Edward 8. Murphy, Elisabeth, N. J., assignor of one-half to Jack Slavltt, Newark, N. J.

Application June 10, 1941, Serial No. 397,479

17 Claims.

My invention relates to electrical translating devices such as radio tubes, gaseous discharge lamps, or the like, and has particular reference to a method of attaching the wires of such devices with their terminals.

In the production of the conventional radio tubes, a case or tube is provided and a head is attached to one end of the tube. This head carries a plurality of wires which are embedded in the insulating material of the head and lead to the interior of the tube for connection with the operating elements and extend to the exterior of the tube for connection with the terminals. It is the practice to embed tubular terminals in a base formed of insulating material, such as Bakelite. These tubular terminals are open at both ends and the wires carried by the head are relatively long and are threaded through and beyond the tubular terminals. The insulating base is brought to the closed position and the tube is locked to the base by staking or other means. The wires now extend outwardly beyond the tubular terminals and these wires are now out off so that they terminate near the outer ends of the terminals. The assembled unit is inverted and the outer ends of the terminals are dipped into molten solder whereby the wires are soldered to the tubular terminals at their outer ends. This method is time consuming and expensive inasmuch as it involves a number of steps including the straightening out of the wires, the threading of the wires through the tubular terminals, and the cutting of! of the wires prior to soldering.

In accordance with my method, the wires are secured to the head or end of the radio tube, lamp, or the like in the conventional manner and extend into the tube for connection with the operating elements and also extend to the exterlor of the tube. However, my wires extend to the exterior of the tube for only a relatively short distance and this enables them to remain vertical and straight until bent, if desired. It is preferred that these wires be originally short, to eliminate cutting, but of course they;could be longer and subsequently cut oil, after being embedded in the head. These relatively short wires are brought into engagement with solder carried by the inner ends of the terminals which are carried by or embedded in an insulating base, and after the insulating base is placed upon the tube, the solder at the inner ends of the terminals is heated so that it melts and forms proper steps of the method may be performed by automatic machinery.

In the accompanying drawings forming a part of this application and in which like numerals are employed to designate like parts throughout the same:

Figure 1 is a side elevation, parts in vertical section, showing a radio tube having the wires attached thereto in accordance with my method,

Figure 2 is a similar view, showing the toolraised after being shifted downwardly to bend the short wires outwardly,

Figure 3 is an end elevation of the tool,

Figure 3- is a similar view of the tube,

Figure 4 is a side elevation of the tube, parts in central vertical section, showing the terminal carrying base arranged near the tube so that the wires will contact with the solder of the terminals, upon the downward movement of the base,

Figure 5 is a transverse section taken on line 55 of Figure 4,

Figure 6 is a view similar to Figure 4 with the terminal carrying base completely lowered with respect to the tube and attached thereto by staki s,

Figure 7 is a view similar to Figure 6, showing a heating element applied to the terminals to heat the terminals and the solder secured to their inner ends,

Figure 8 is a horizontal section taken on line 88 of Figure '7,

Figure 9 is an enlarged detailed section through one of the terminals showing the melted solder at its inner end and forming the electrical connection between the terminal and the wire.

In the drawings, wherein for the purpose of illustration is shown a preferred embodiment of my invention, the numeral l0 designates a tube of a radio tube. The tube l0 may be of metal as is the case with so-called metal tubes. The tube l0 contains the operating elements of the radio tube. At one end of the tube l0 it is provided with a flange H and a shoulder I! for receiving and supporting a head l3. The flange i I extends longitudinally beyond the tube In and forms with the tube 10 a tube or casing. This head may be formed of an outer metal portion l4 carrying an inner glass portion i5 provided with the usual tube It to evacuate the tube and the tube I 6 is then closed by pinching. This is the conventional construction. Embedded in the glass portion ii are wires l1, which extend into the interior of the tube I II for connection with the operating parts of the device. The wires II also extend to the exterior of the tube l0 upon the outer side of the head I3. The wires I! are formed in sections having different coeflicients of expansion, as is well known. The wires I! extend beyond the head l3, as stated, but are relatively short; The wires I! are preferably originally cut electrodes.

short they do extend for a short distance beyond 2 relatively short before being embedded in the head It, whereby the trimming ofthe outer ends of the wires is eliminated. This not only effects a saving in the wire but the relatively short wires l1 readily remain vertical and straight until bent and do not becomedisplaced. By the use of the short wires I eliminate the step. of separating and straightening out the long wires prior to threading such long wires through the tubular While the wires I'I are relatively the flange II. I

I next bend the ends of the short wires l1 radially outwardly forming angularly disposed ends l8 which when bent will occupy predetermined circumferential and radial positions.

The benda ing is effected by bring ng a bending tool I! vrires enter the notches 2| which produce the outwardly inclined ends I8 and these bent ends are properly located to assume correct circumferential and radial positions. bend the wires i I, but under certain circumstances bending may be eliminated.

The numeral 22 designates an insulating base, formed of "Bakelite or the like, and this' base has tubular terminals 23 embedded therein and extending to the inner and outer sides of the base. The tubular terminals 23 may have their outer ends closed while their inner ends are formed open and solder 24 is applied to the inner ends of the tubular terminals 23 after they are embedded in the base. In applying the solder to each tubular terminal 23, a drop of molten solder is applied to the open inner end of the tubular terminal, and this drop of solder is allowed to cool to produce a solid mass, before the solder massis brought down into engagement with the bent wire ll. Since the terminals are tubular the molten solder will enter the inner ends of the same, and this aids in securing the solder to the terminals. It is preferred to use tubular terminals, for the reasons stated, but the invention is not restricted to this feature as satisfactory results can be obtained by using solid terminals. The terminals correspond in number and radial and circumferential arrangement to the bent ends it of the wires and the base 22 is now brought down over the flange l l and the solder 24 at the inner ends of the terminals will engagev the bent ends 18. The base 22 and flange I I may have suitable markings sothat the terminals 23 will align with the bent ends 18 of the wires. This arrangement is shown in Figure 4. The next step is to move the base 22 downwardly to the completely closed position so that its lower portion enters the flange H and the base is then locked to the flange by staking at points, as is It is preferred tostraighten out and firmly embed themselves in the solder. v

The next step in the method is to heat the solder to melt the same so that it will positively and securely attach itself to the terminal and to the wire thus effecting a secure electrical connection between these elements. To'effect this heating of the solder upon the inner ends of the termi-' nals, I provide a preferably metal heating elelar extension 21 of the base 22. The opening 28 is preferably lined with .an asbestos sleeve 28 so that the heat will not injure the extension 21 which is formed of Bakelite or the like.- The heating element25 has cylindrical openings 29 which receive the terminals 23 and have substantially a sliding fit therewith and hence contact with thesame. The'heatin'g element 25 is heated. and while hot is applied to the terminals 23 and this thermal contact heats the terminals 23 and this heat passes by conduction through the terminals to the solder 24- whichinstantly melts and attaches itself to the terminal and the wire. The heating element25 is preferably heated to the temperature of that used in connection with the ordinary electrical soldering iron and the heating element is applied to the terminals 23 for only a few seconds, such as around 3 seconds, more or less. The heating element is moved longitudinally of the terminals to apply itself to the same and then longitudinally off the same in an opposite direction to remove it and this is ordinarily sufficient time to transmit sufficient heat to melt the solder. The invention is not restricted to the precise time element in the heating step as the same will vary somewhat depending upon the degree of heat of the heating. element, the character of the solder, and the speed at which the heating element is applied to and removed from the terminals. This can be determined readily by tests.

While I have shown one method of heating the solder to melt the same the invention is not restricted to this precise method as I contemplate using other methods such as passing current through the solder 0r subjecting the terminal to the action of infra-red rays or high frequency current or the like to heat the same.

Figure 9 showsthe solder 24 after it is melted and attached tothe terminal 23 and to the wire 24. The solder mass was solid before melting, and upon melting the bent resilient wire l'l, under compression, expands and forces its end into the molten solder to become securely embedded therein.

'1 also contemplate using a solder mass which is plastic while cold. This cold plastic solder mass never hardens until melted by heat. The cold plastic solder mass is introduced into the inner open ends of the tubular terminals, and remains plastic when brought into engagement with the bent wires l1, upon the'downward movement of the head 22. The bent wires readily sink into the cold plastic solder mass and contact with the terminals. The cold plastic solder mass may consist of'finely ground solder'particles mixed with a commercial soldering flux such as No- Korode. This flux is a sticky acid pastewhich keeps the parts to be soldered clean. After the bent wires have become embedded in the cold plastic solder mass the terminals may be heated to the plastic solder mass, whereby the solder cally.

particles are melted,an d upon the removal of the heating element the. solder mass will harden and become solid and thereby securely attach the wires to the terminals. All other steps of the method remain identical with those described in connection with the solid solder mass.

In the practice of the'method, it is preferred to arrange the tube I. vertically, and the relatively short lead wires II will then be vertical, before bending. The tube II will be supported in the vertical position by any suitable means. It is also preferred to arrange the bending tool ll vertically, and to reciprocate the same verti- It is preferred to arrange the head 22 horizontally with the solder masses 2 next to the bent lead wires l1, and to move the head 22 downwardly in a vertical line to bring the solder masses into engagement with the lead wires. Howeveathe invention is in no sense restricted to the vertical arrangement of parts and to the vertical movements of elements, as the same may be changed to horizontal positions or angular.

position. apply n solder masses to the ends of terminals carried by an insulating base,

While I have shown and described my method as applied to the product of a radio tube, yet

the invention is not restricted to this application as I contemplate using the same in producing other translating electrical devices having a plurality of wires to be connected with a plurality of terminals such as gaseous discharge lamps including fluorescent lamps and the like.

It is to be understood that the form of my invention herewith shown and described is to be taken as a preferred example 0! the same-and that various changes in the shape, size, and ar-' rangement of parts may be restorted to, and changes may be made in the order of the steps of the method without departing from the spirit of the invention or the scope of the subjoined claims.

Having thus described my invention, what I I claim is:

" same.

2. The method comprising arranging lead wires of an electrical translating device in a selected position, bending the wires laterally, applying solid solder masses to the ends of terminals carried by an insulating base, arranging the and the wires to bring the solid solder masses into engagement with the wires to place them under compression, and heating the solid solder masses to melt the same.

3. The method comprising arranging lead wires of an electrical translating device in a sesolid solder masses next to the wires, effecting I a relative closing movement between the base tions of the termi the solder masses next to the wires, ef- "fecting a relative closing movement between the baseandthewirestobringthesoldermasses into engagement with the wires, and heating the solder masses.

.4. The method comprising forming relatively short lead wires upon an electrical translating device and rendering such lead wires accessible from the exterior of the device, arranging the relatively short lead wires in a selected position, applying'solder masses to the ends of terminals carried by an insulating base, arranging the solder masses next to the wires, eiiecting a relative closing movement between the base and the wires to bring the solder masses into engagement with the wires, and heating the solder to melt the same.

5. The method comprising forming relatively short lead wires upon an electrical translating device and rendering such lead wires accesible from the exterior of the device, arranging the relatively short lead wires in a selected position, applying solder masses to the ends of terminals carried by an insulating base, arranging the solder masses next to the wires, effecting a relative closing movement between the base and the wires to bring the solder masses into engagement with the wires, and applying heat to the end por- 'ls which remote from the solder masses. ;..1:' v r 1* T 6. The method comprising relatively short resilient leadrf wires upon an electrical vtranslating device and rendering such lead wires accessible'irom the exterior of "the device, arrename the lead wires in a selected position, applying solid solder masses to the ends of terminals carried by an insulatingbase, arranging the solid solder masses next'tothe wires, effecting a relative---'closingf,movement between the and theQ-wire's'to bringtlie' solid solder/masses mm engagement with the wires and thereby placing the resilient wires under compression,

. and applying heat to the terminals to melt the solder by the conduction of heat.

7. The method comprising forming relatively short lead wires upon an electrical translating device and rendering the lead wires accessible from the exterior of the device, the wires retaining their shape by virtue of their relative shortness, holding the device in a selected position, applying solder masses to the ends of terminals carried by an insulating base, arranging the solder masses next to the wires, effecting a relative closing movement between the base and the wires to bring the solder masses into engagement with the wires, securing the base to the device, and bringing a heated element into contact with the terminals to heat the same to melt the solder by the conduction of heat.

8. The method comprising the steps of supporting a resilient lead wire, applying a solder mass to a terminal, arranging the solder mass next to the resilient wire, eiIecting a relative closing movement between the terminal and the resilient wire to bring the solder mass into engagement with the resilient wire and place the same under compression, and melting the solder mass, the resilient compressed wire expanding and entering the molten solder mass.

9. The method comprising the steps of supporting a resilient lead wire, applying.a solder mass to a terminal, arranging the solder mass next to the resilient wire, eifecting a relative closing movement between the terminal and the resilient wire to bring the solder mass into engagement with the resilient wire and place the wire under compression, and applying heat to the terminal to melt, the solder mass by the conduction of heat through the terminal.

- 10. The method of basing an electrical translating device having a casing and lead wires extending into the casing and having outer ends which are accessible from the exterior oi! the casing, said method comprising the steps of arranging the lead wires substantially vertical,

-bending the .outer ends of the lead wires laterally,

moving an insulating base and terminals carried thereby which terminals extend to the inner and outer surfaces of the insulating base and have solid solder masses applied to their inner ends downwardly toward the lead wires so that the solid solder masses are brought into engagement with the-lead wires and the lead wires placed under compression, and then applying heat to the terminals upon the. outer side of the base to cause the solidsoldermasses to be melted by,

the conduction of heat through the terminals, the resilient compressed lead wires expanding and entering the molten solder.

11. The method of basing an electrical translating device having a casing provided with an open end and lead wires extending into the open end to be accessiblefrom the exterior oi the casing, said method comprising the steps of arranging the lead wires substantially vertical, bending the lead wires laterally, applying solder to the ends of terminals which are carried by an insulating base and which terminals ex- -tend upon opposite sides of the base, arranging the base above the lead wires and the solder next to the lead wires, eflecting a relative closing movement between the base and the casing to bring the solder into engagement with the bent wires and the insulating base into the open end I of the casing, and applying heat to the terminals upon the opposite side of the base with respect to the solder to cause the solder to be melted by the conduction of heat through the terminals.

12. The method of basing an electrical translating device having a casing provided with an opening and lead wires extending to the open ing to be accessible from the exterior of the casing, said method comprising the steps oi arranging the leadwires generally vertical, applying solder'to the ends of terminals upon one'side of an insulating base which carries the terminals and the terminals extending. ,upon the op posite side of the insulating base, arranging theinsulating base above the lead, wires and the ends of the terminals carrying the solder beneath the base, eflecting a relative closing movement between the base and the casing to bring the solder into engagement with the wires and the masses into engagement with the short lead wires and coveringthe short lead wires when engaging ends of tubular terminals which are carried by an insulating base, effecting a relative closing unit, and the short lead wires to bring the cold plasticsolder masses into engagement with the short lead'wires and covering the short lead wires when engaging the cold solder masses by the insulating base, securing the insulating base in place upon the casing, and then applying heat to the terminals upon the outer side of the insulating base.

15. The method of basing an electrical translating device having a casing and a lead wire which is accessible from the exterior of the casing, comprising the steps of effecting relative closing movement between a terminal having a solder mass applied thereto and carried by an insulating base, and the lead wire to bring the solder mass into contact with the lead wire and causing the insulating base to form with the casing a substantially inaccessible space housing V through the open end of the casing, comprising the steps 0! effecting a relative closing movement-between terminals having solder masses applied thereto and carried by an insulating base,

and the lead wires to bring the solder masses into engagement with the lead wires and the insulating base into the open end of the casing to form with the casing a substantially inaccessible space housing the contacting solder masses and lead wires, securing the base to the casing,

and then applying heat to the terminals exv masses applied thereto and carried by an insulating base, and the lead wires to bring the solder masses into engagement with the lead wires and the insulating base into a position to cover the opening to render the contacting lead wires and solder masses substantially inaccessible, securing the base in place upon the casing, and applying heat to the terminals cxteriorly oi the base to melt the solder masses by the-conduction of heat through the terminals.

EDWARD R. MURPHY: 

